000 | 01016nam a2200289zi 4500 | ||
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005 | 20220221131545.0 | ||
008 | 050426s2004 xxua b 001 0 eng | ||
020 | _a0824748700 | ||
035 | _aMX001001016141 | ||
040 |
_aTEF _bspa _cTEF _dOCLCQ _dDLC _dUKM _dUNAMX |
||
050 | 4 |
_aTK7874 _bH35825 |
|
245 | 0 | 0 |
_aHandbook of lead-free solder technology for microelectronic assemblies / _cedited by Karl J. Puttlitz, Kathleen A. Stalter |
264 | 1 |
_aNew York : _bM. Dekker, _cc2004 |
|
300 |
_axi, 1026 páginas : _bilustraciones |
||
490 | 1 |
_aMechanical engineering ; _v170 |
|
650 | 0 | _aSoldadura y soldadores | |
650 | 0 | _aMicroelectrónica | |
650 | 0 | _aProductos ecológicos | |
650 | 0 | _aProtección ambiental | |
700 | 1 |
_aPuttlitz, Karl J., _eeditor |
|
700 | 1 |
_aStalter, Kathleen A., _eeditor |
|
830 | 0 |
_aMechanical engineering (Marcel Dekker, Inc.) ; _v170 |
|
336 |
_atexto _2rdacontent |
||
337 |
_asin medio _2rdamedia |
||
338 |
_avolumen _2rdacarrier |
||
999 |
_c16179 _d16179 |