000 | 01065nam a2200325zi 4500 | ||
---|---|---|---|
005 | 20220221131639.0 | ||
008 | 080606s2008 enka 000 0 eng d | ||
020 | _a9781845691790 (Woodhead) | ||
020 | _a1845691792 (Woodhead) | ||
020 | _a9781420070835 (CRC) | ||
020 | _a1420070835 (CRC) | ||
035 | _aMX001001145128 | ||
040 |
_aBTCTA _bspa _cBTCTA _dBAKER _dYDXCP _dGZM _dBWX _dUNAMX |
||
050 | 4 |
_aTS226 _bM53 |
|
245 | 0 | 0 |
_aMicrojoining and nanojoining / _cedited by Y. Zhou |
246 | 3 | 0 | _aMicrojoining & nanojoining |
264 | 1 |
_aCambridge, England : _bWoodhead Publishing ; _aBoca Raton : _bCRC Press, _c2008 |
|
300 |
_axxiv, 810 páginas : _bilustraciones |
||
490 | 0 | _aWoodhead Publishing in materials | |
650 | 4 | _aEnlace metálico | |
650 | 4 | _aSellado (Tecnología) | |
650 | 4 | _aMicroelectrónica | |
650 | 4 | _aMicrotecnología | |
650 | 4 | _aNanoelectrónica | |
700 | 1 |
_aZhou, Y., _eeditor |
|
336 |
_atexto _2rdacontent |
||
337 |
_asin medio _2rdamedia |
||
338 |
_avolumen _2rdacarrier |
||
999 |
_c19245 _d19245 |